Invention Application
US20070151505A1 Method for producing high quality silicon single crystal ingot and silicon single crystal wafer made thereby 有权
由此制造高品质硅单晶锭和硅单晶晶片的方法

  • Patent Title: Method for producing high quality silicon single crystal ingot and silicon single crystal wafer made thereby
  • Patent Title (中): 由此制造高品质硅单晶锭和硅单晶晶片的方法
  • Application No.: US11643201
    Application Date: 2006-12-21
  • Publication No.: US20070151505A1
    Publication Date: 2007-07-05
  • Inventor: Hyon-Jong Cho
  • Applicant: Hyon-Jong Cho
  • Assignee: SILTRON INC.
  • Current Assignee: SILTRON INC.
  • Priority: KR10-2005-0135365 20051230; KR10-2006-0101952 20061019
  • Main IPC: C30B5/00
  • IPC: C30B5/00 C30B15/00 C30B19/00 C30B21/06
Method for producing high quality silicon single crystal ingot and silicon single crystal wafer made thereby
Abstract:
In a method for producing a high quality silicon single crystal by the Czochralski method, a lower portion of a solid-liquid interface of a single crystal growth is divided into a central part and a circumferential part, and the temperature gradient of the central part and the temperature gradient of the circumferential part are separately controlled. When a silicon melt located at a lower portion of a solid-liquid interface of a single crystal growth is divided into a central part melt and a circumferential part melt, the method controls the temperature gradient of the central part melt by directly controlling the temperature distribution of a melt and indirectly controls the temperature gradient of the circumferential part melt by controlling the temperature gradient of the single crystal, thereby effectively controlling the overall temperature distribution of the melt, thus producing a high quality single crystal ingot free of defects with a high growth velocity.
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