Invention Application
- Patent Title: SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Patent Title (中): 半导体器件及其制造方法
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Application No.: US11382994Application Date: 2006-05-12
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Publication No.: US20060261371A1Publication Date: 2006-11-23
- Inventor: Masayuki Kuroda , Hidetoshi Ishida , Tetsuzo Ueda
- Applicant: Masayuki Kuroda , Hidetoshi Ishida , Tetsuzo Ueda
- Applicant Address: JP Osaka
- Assignee: Matsushita Electric Industrial Co., Ltd.
- Current Assignee: Matsushita Electric Industrial Co., Ltd.
- Current Assignee Address: JP Osaka
- Priority: JP2005/146265 20050519
- Main IPC: H01L29/739
- IPC: H01L29/739

Abstract:
An object of the present invention is to provide a semiconductor device and a manufacturing method thereof which can realize a normally-off field-effect transistor made of a III group nitride semiconductor. The present invention includes: placing a sapphire substrate in a crystal growth chamber; forming a low-temperature GaN buffer layer made of GaN as the III group nitride semiconductor, on a main surface of the sapphire substrate by a MOCVD method; and forming a GaN layer on the low-temperature GaN buffer layer by the MOCVD method. Here, a [11-20] axis of the GaN layer is perpendicular to the main surface of the sapphire substrate.
Public/Granted literature
- US07595544B2 Semiconductor device and manufacturing method thereof Public/Granted day:2009-09-29
Information query
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