Invention Application
- Patent Title: CPP spin valve with ultra-thin CoFe(50%) laminations
- Patent Title (中): CPP自旋阀具有超薄CoFe（50％）叠片
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Application No.: US10933031Application Date: 2004-09-02
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Publication No.: US20060044704A1Publication Date: 2006-03-02
- Inventor: Min Li , Kunliang Zhang , Cheng Horng , Chyu Torng , Yu-Hsia Chen , Ru-Ying Tong
- Applicant: Min Li , Kunliang Zhang , Cheng Horng , Chyu Torng , Yu-Hsia Chen , Ru-Ying Tong
- Assignee: Headway Technologies, Inc.
- Current Assignee: Headway Technologies, Inc.
- Main IPC: G11B5/33
- IPC: G11B5/33 ; G11B5/127
Abstract:
Fe rich CoFe can be used in AP1 to enhance CPP GMR. However, this is found to degrade the electro-migration performance of the device. This problem has been solved by using an AP1 that is a laminate of several CoFe(25%) layers, separated from one another by copper layers. Ultra-thin layers of iron-rich CoFe are then inserted at all the copper-CoFe interfaces.
Public/Granted literature
- US07288281B2 CPP spin valve with ultra-thin CoFe(50%) laminations Public/Granted day:2007-10-30
Information query
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