An apparatus for depositing a thin film on a substrate includes a housing, a substrate support portion, a securing member, a heater, a target member and a plasma generator. The housing defines a process chamber. The substrate support portion is disposed in the process chamber to support the substrate. The securing member is adapted to non-electrically secure the substrate to the substrate support portion during performance of a process. The heater is provided to maintain the substrate supported by the substrate support portion at a process temperature. The target member faces the substrate support portion and includes materials to be deposited on the substrate. The plasma generator is adapted to excite a process gas supplied into the process chamber into a plasma state.