发明申请
- 专利标题： Heating device
- 专利标题（中）： 加热装置
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申请号： US11140668申请日： 2005-05-27
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公开(公告)号： US20050263516A1公开(公告)日： 2005-12-01
- 发明人: Masuhiro Natsuhara , Hirohiko Nakata , Akira Kuibira , Kenji Shinma
- 申请人： Masuhiro Natsuhara , Hirohiko Nakata , Akira Kuibira , Kenji Shinma
- 申请人地址： JP Osaka-shi
- 专利权人： Sumitomo Electric Industries, Ltd.
- 当前专利权人： Sumitomo Electric Industries, Ltd.
- 当前专利权人地址： JP Osaka-shi
- 优先权： JP2004-158678 20040528
- 主分类号： H05B3/20
- IPC分类号： H05B3/20 ; F27B17/00 ; F27D11/00 ; F27D99/00 ; H01L21/00 ; H01L21/02 ; H01L21/66 ; H01L21/68 ; H01L21/683 ; H05B3/06 ; H05B3/10 ; H05B3/74
摘要：
The present invention provides a heating device which is rigid with little likelihood of warping. The workpiece mounting surface has a high thermal conductivity, and there is improved heat uniformity, and rapid cooling is possible. The heating device of the present invention comprises: a mounting part for mounting the workpiece; a heating part which has a resistance heating element and which heats the mounting part; and a support part which supports the mounting part and heating part. The Young's modulus for each of the mounting part and support part is 100 GPa or greater. By having a Young's modulus of 100 GPa or greater, even if the mounting part is thin, there is little deformation when pressed by a probe card.
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