Invention Application
US20050179457A1 Burn-in test apparatus for BGA packages using forced heat exhaust
失效
使用强制排热的BGA封装的老化测试装置
- Patent Title: Burn-in test apparatus for BGA packages using forced heat exhaust
- Patent Title (中): 使用强制排热的BGA封装的老化测试装置
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Application No.: US11025092Application Date: 2004-12-28
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Publication No.: US20050179457A1Publication Date: 2005-08-18
- Inventor: Byung-Jun Min , Woo-Jin Kim , Jeong-Ho Bang , Hyun-Seop Shim , Hyun-Geun Iy , Jae-Il Lee
- Applicant: Byung-Jun Min , Woo-Jin Kim , Jeong-Ho Bang , Hyun-Seop Shim , Hyun-Geun Iy , Jae-Il Lee
- Priority: KR2004-10375 20040217
- Main IPC: H01L21/66
- IPC: H01L21/66 ; G01R1/04 ; G01R31/02 ; G01R31/28

Abstract:
A forced air heat exhaust type of burn-in test apparatus for packages: A first air supply duct provides air to the burn-in chamber and a second air supply duct provides air to supply tubes that direst air into the test sockets that hold the packages. The test sockets have a structure that allows air ventilation of the conductive balls. Accordingly, the apparatus can control the temperature around the packages as well as the temperature in the burn-in chamber, thus preventing conductive ball-melting.
Public/Granted literature
- US07084655B2 Burn-in test apparatus for BGA packages using forced heat exhaust Public/Granted day:2006-08-01
Information query
IPC分类: