Invention Application
- Patent Title: Dielectric laminate for a capacitor
- Patent Title (中): 用于电容器的电介质层压板
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Application No.: US10830596Application Date: 2004-04-24
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Publication No.: US20040196620A1Publication Date: 2004-10-07
- Inventor: Philip D. Knudsen , Craig S. Allen
- Applicant: Shipley Company, L.L.C.
- Applicant Address: MA Marlborough
- Assignee: Shipley Company, L.L.C.
- Current Assignee: Shipley Company, L.L.C.
- Current Assignee Address: MA Marlborough
- Main IPC: H01G004/06
- IPC: H01G004/06

Abstract:
A dielectric composed of a core material between two polymer layers that have permittivity values less than the core material. The polymer layers provide structural integrity for the dielectric. The dielectric can be employed in a capacitor to fine tune the capacitance of the capacitor. The dielectric and the capacitor may have a thickness in the micron range. Accordingly, the dielectric and capacitor provide for the miniaturization of electronic devices. The dielectric may be employed in decoupling capacitors to reduce noise in electronic devices.
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