Invention Application
- Patent Title: Electrostatic chuck having composite dielectric layer and method of manufacture
- Patent Title (中): 具有复合介电层的静电吸盘及其制造方法
-
Application No.: US10095914Application Date: 2002-03-12
-
Publication No.: US20020135969A1Publication Date: 2002-09-26
- Inventor: Edwin C. Weldon , Kenneth S. Collins , Arik Donde , Brian Lue , Dan Maydan , Robert J. Steger , Timothy Dyer , Ananda H. Kumar , Alexander M. Veytser , Kadthala R. Narendrnath , Semyon L. Kats , Arnold Kholodenko , Shamouil Shamouilian , Dennis S. Grimard
- Applicant: Applied Materials, Inc.
- Applicant Address: null
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: null
- Main IPC: H01H001/00
- IPC: H01H001/00
Abstract:
An electrostatic chuck has an electrode capable of being electrically charged to electrostatically hold a substrate. A composite layer covers the electrode. The composite layer comprises (1) a first dielectric material covering a central portion of the electrode, and (2) a second dielectric material covering a peripheral portion of the electrode, the second dielectric material having a different composition than the composition of the first dielectric material. The chuck is useful in a plasma process chamber to process substrates, such as semiconductor wafers.
Public/Granted literature
- US06721162B2 Electrostatic chuck having composite dielectric layer and method of manufacture Public/Granted day:2004-04-13
Information query
