Invention Application
US20020047198A1 Semiconductor device package and lead frame with die overhanging lead frame pad
有权
半导体器件封装和引线框架与裸露引线框架垫
- Patent Title: Semiconductor device package and lead frame with die overhanging lead frame pad
- Patent Title (中): 半导体器件封装和引线框架与裸露引线框架垫
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Application No.: US10002252Application Date: 2001-10-26
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Publication No.: US20020047198A1Publication Date: 2002-04-25
- Inventor: Tim Sammon
- Applicant: International Rectifier Corp.
- Applicant Address: null
- Assignee: International Rectifier Corp.
- Current Assignee: International Rectifier Corp.
- Current Assignee Address: null
- Main IPC: H01L023/48
- IPC: H01L023/48
Abstract:
Semiconductor die are soldered or epoxy bonded to lead frame pads and overhang the pads to reduce thermal differential expansion and contraction stresses applied to the die from the lead frame pad. A plastic housing of standard size is unchanged in dimension, but contains a greater total silicon die area.
Public/Granted literature
- US06433424B1 Semiconductor device package and lead frame with die overhanging lead frame pad Public/Granted day:2002-08-13
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