Invention Grant
- Patent Title: Semiconductor device, method of manufacturing the same, and massive data storage system including the same
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Application No.: US17354445Application Date: 2021-06-22
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Publication No.: US12302561B2Publication Date: 2025-05-13
- Inventor: Minjun Kang , Byunggon Park , Joongshik Shin
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Muir Patent Law, PLLC
- Priority: KR10-2020-0166311 20201202
- Main IPC: H01L27/11582
- IPC: H01L27/11582 ; H01L27/11529 ; H01L27/11556 ; H01L27/11573 ; H10B41/27 ; H10B41/41 ; H10B43/27 ; H10B43/40

Abstract:
A semiconductor device including a gate electrode structure on a substrate and including gate electrodes spaced apart from each other in a first direction, each gate electrode extending in a second direction; a memory channel structure extending through the gate electrode structure on the substrate, the memory channel structure including a channel extending in the first direction; a charge storage structure surrounding an outer sidewall of the channel; a first filling pattern filling an inner space formed by the channel; and a first capping pattern on the channel and the first filling pattern; and a dummy charge storage structure extending through the gate electrode structure on the substrate, the dummy charge storage structure including a second filling pattern extending in the first direction; a dummy charge storage structure surrounding an outer sidewall of the second filling pattern; and a second capping pattern on the second filling pattern.
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