- 专利标题: Silicon carbide epitaxial substrate and silicon carbide semiconductor device
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申请号: US17274859申请日: 2019-08-08
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公开(公告)号: US12125881B2公开(公告)日: 2024-10-22
- 发明人: Tsutomu Hori , Hiromu Shiomi , Takaya Miyase
- 申请人: SUMITOMO ELECTRIC INDUSTRIES, LTD.
- 申请人地址: JP Osaka
- 专利权人: Sumitomo Electric Industries, Ltd.
- 当前专利权人: Sumitomo Electric Industries, Ltd.
- 当前专利权人地址: JP Osaka
- 代理机构: Renner, Otto, Boisselle & Sklar, LLP
- 优先权: JP 18227550 2018.12.04
- 国际申请: PCT/JP2019/031351 2019.08.08
- 国际公布: WO2020/115951A 2020.06.11
- 进入国家日期: 2021-03-10
- 主分类号: H01L31/0312
- IPC分类号: H01L31/0312 ; C30B25/20 ; C30B29/36 ; H01L29/16
摘要:
A silicon carbide epitaxial layer includes a first silicon carbide layer, a second silicon carbide layer, a third silicon carbide layer, and a fourth silicon carbide layer. A nitrogen concentration of the second silicon carbide layer is increased from the first silicon carbide layer toward the third silicon carbide layer. A value obtained by dividing, by a thickness of the second silicon carbide layer, a value obtained by subtracting a nitrogen concentration of the first silicon carbide layer from a nitrogen concentration of the third silicon carbide layer is less than or equal to 6×1023 cm−4. Assuming that the nitrogen concentration of the third silicon carbide layer is N cm−3 and a thickness of the third silicon carbide layer is X μm, X and N satisfy a Formula 1.
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