- 专利标题: Cooling apparatus and data center
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申请号: US17964120申请日: 2022-10-12
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公开(公告)号: US12120855B2公开(公告)日: 2024-10-15
- 发明人: Jihui Liu , Jun Chen
- 申请人: Huawei Digital Power Technologies Co., Ltd.
- 申请人地址: CN Shenzhen
- 专利权人: Huawei Digital Power Technologies Co., Ltd.
- 当前专利权人: Huawei Digital Power Technologies Co., Ltd.
- 当前专利权人地址: CN Shenzhen
- 代理机构: Maier & Maier, PLLC
- 优先权: CN 2122457576.9 2021.10.12
- 主分类号: H05K7/20
- IPC分类号: H05K7/20
摘要:
A cooling apparatus includes a housing, a cooling air duct, and an adsorption refrigeration unit. The housing includes a plurality of sidewalls, and the plurality of sidewalls form an inner cavity. The cooling air duct passes through the inner cavity. The adsorption refrigeration unit includes an adsorption bed, a flash evaporator, and an air cooler, the flash evaporator is connected to the air cooler, both the flash evaporator and the air cooler are disposed in the inner cavity, and the air cooler is located on a path of the cooling air duct. At least one of the plurality of sidewalls is a refrigeration sidewall, the refrigeration sidewall includes an internal wall plate and an external wall plate, the internal wall plate and the external wall plate are spaced apart and form sealed space, the sealed space is connected to the flash evaporator.
公开/授权文献
- US20230115991A1 COOLING APPARATUS AND DATA CENTER 公开/授权日:2023-04-13
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