- 专利标题: Thermal conductivity estimation method, thermal conductivity estimation apparatus, production method for semiconductor crystal product, thermal conductivity calculator, thermal conductivity calculation program, and, thermal conductivity calculation method
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申请号: US17297080申请日: 2019-11-18
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公开(公告)号: US12099026B2公开(公告)日: 2024-09-24
- 发明人: Ryusuke Yokoyama , Toshiyuki Fujiwara , Yusuke Higuchi , Toru Ujihara
- 申请人: SUMCO CORPORATION
- 申请人地址: JP Tokyo
- 专利权人: SUMCO CORPORATION
- 当前专利权人: SUMCO CORPORATION
- 当前专利权人地址: JP Tokyo
- 代理机构: Greenblum & Bernstein, P.L.C.
- 优先权: JP 18222618 2018.11.28
- 国际申请: PCT/JP2019/045041 2019.11.18
- 国际公布: WO2020/110796A 2020.06.04
- 进入国家日期: 2021-05-26
- 主分类号: G01N25/18
- IPC分类号: G01N25/18 ; C30B15/20 ; C30B35/00 ; G01N27/18 ; G06N20/00 ; C30B29/36
摘要:
A thermal conductivity estimation method includes: measuring temperature distribution of a measurement sample surface in a steady state by partially heating the measurement sample under predetermined heating conditions; calculating temperature distribution of a sample model surface by performing a heat-transfer simulation on the sample model of the same shape as the measurement sample for a plurality of combinations of provisional thermal conductivities and heating conditions; making a regression model, whose input is temperature distribution of the measurement sample surface and whose output is a thermal conductivity of the measurement sample, by a machine learning technique using training data in a form of a calculation result of the plurality of combinations and the temperature distribution obtained from the plurality of combinations; and estimating the thermal conductivity of the measurement sample by inputting a measurement result of the temperature distribution of the measurement sample surface into the regression model.
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