- 专利标题： Package structure and method of forming the same
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申请号： US18446146申请日： 2023-08-08
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公开(公告)号： US12058101B2公开(公告)日： 2024-08-06
- 发明人: Chen-Hua Yu , Chih-Hua Chen , Hao-Yi Tsai , Yu-Feng Chen
- 申请人： Taiwan Semiconductor Manufacturing Co., Ltd.
- 申请人地址： TW Hsinchu
- 专利权人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- 当前专利权人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- 当前专利权人地址： TW Hsin-Chu
- 代理机构： Slater Matsil, LLP
- 分案原申请号： US17188707 2021.03.01
- 主分类号： H01L27/14
- IPC分类号： H01L27/14 ; G06F15/16 ; G06F21/51 ; G06F21/56 ; H01L21/48 ; H01L21/768 ; H01L23/00 ; H01L23/13 ; H01L23/48 ; H01L23/538 ; H04L9/40 ; H04L61/10 ; H04L61/4511 ; H10N10/01 ; H01L21/56 ; H01L23/498 ; H04L101/604
摘要：
Package structures and methods of forming package structures are described. A method includes placing a first package within a recess of a first substrate. The first package includes a first die. The method further includes attaching a first sensor to the first package and the first substrate. The first sensor is electrically coupled to the first package and the first substrate.
公开/授权文献
- US20230386975A1 PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME 公开/授权日：2023-11-30
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