- 专利标题: Semiconductor device and method for forming the same
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申请号: US17093549申请日: 2020-11-09
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公开(公告)号: US12027602B2公开(公告)日: 2024-07-02
- 发明人: Jian-Feng Li , Chia-Hua Chang , Hsiang-Chieh Yen
- 申请人: UNITED MICROELECTRONICS CORP.
- 申请人地址: TW Hsin-Chu
- 专利权人: UNITED MICROELECTRONICS CORP.
- 当前专利权人: UNITED MICROELECTRONICS CORP.
- 当前专利权人地址: TW Hsin-Chu
- 代理商 Winston Hsu
- 优先权: CN 2011083391.X 2020.10.12
- 主分类号: H01L29/66
- IPC分类号: H01L29/66 ; H01L21/02 ; H01L29/20 ; H01L29/778
摘要:
A high electron mobility transistor (HEMT) is disclosed. The HEMT includes a substrate, a first epitaxial layer disposed on the substrate, a second epitaxial layer disposed on the first epitaxial layer, a third epitaxial layer disposed on the second epitaxial layer, and a gate disposed on the third epitaxial layer. An upper portion of the first epitaxial layer has a plurality of first recesses. The second epitaxial layer partially fills the first recesses and surrounding a plurality of first air slits in the first recesses.
公开/授权文献
- US20220115520A1 SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME 公开/授权日:2022-04-14
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