- 专利标题: Radio frequency (RF) semiconductor devices including a ground plane layer having a superlattice
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申请号: US17653305申请日: 2022-03-03
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公开(公告)号: US12020926B2公开(公告)日: 2024-06-25
- 发明人: Hideki Takeuchi , Robert J. Mears
- 申请人: ATOMERA INCORPORATED
- 申请人地址: US CA Los Gatos
- 专利权人: ATOMERA INCORPORATED
- 当前专利权人: ATOMERA INCORPORATED
- 当前专利权人地址: US CA Los Gatos
- 代理机构: ALLEN, DYER, DOPPELT + GILCHRIST, P.A.
- 主分类号: H01L29/15
- IPC分类号: H01L29/15 ; H01L21/02 ; H01L29/10 ; H01L29/78
摘要:
A radio frequency (RF) semiconductor device may include a semiconductor-on-insulator substrate, and an RF ground plane layer on the semiconductor-on-insulator substrate including a conductive superlattice. The conductive superlattice may include stacked groups of layers, with each group of layers comprising stacked doped base semiconductor monolayers defining a doped base semiconductor portion, and at least one non-semiconductor monolayer constrained within a crystal lattice of adjacent doped base semiconductor portions. The RF semiconductor device may further include a body above the RF ground plane layer, spaced apart source and drain regions adjacent the body and defining a channel region in the body, and a gate overlying the channel region.
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