A semiconductor package includes source clock circuitry to generate a source clock signal. Reference clock circuitry generates a reference clock signal. A first timing circuit includes a first source clock input to receive the source clock signal. First fan-out circuitry distributes the received source clock signal as a first distributed clock signal to a first set of clocked devices. A first delay circuit delays the received source clock signal by a first delay value based on a first phase difference between the first distributed clock signal and the reference clock signal.