- 专利标题: Methods for making radio frequency (RF) semiconductor devices including a ground plane layer having a superlattice
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申请号: US18213120申请日: 2023-06-22
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公开(公告)号: US12014923B2公开(公告)日: 2024-06-18
- 发明人: Hideki Takeuchi , Robert J. Mears
- 申请人: ATOMERA INCORPORATED
- 申请人地址: US CA Los Gatos
- 专利权人: ATOMERA INCORPORATED
- 当前专利权人: ATOMERA INCORPORATED
- 当前专利权人地址: US CA Los Gatos
- 代理机构: ALLEN, DYER, DOPPELT, + GILCHRIST, P.A.
- 主分类号: H01L21/00
- IPC分类号: H01L21/00 ; H01L21/02 ; H01L29/10 ; H01L29/15 ; H01L29/78
摘要:
A method for making a radio frequency (RF) semiconductor device may include forming an RF ground plane layer on a semiconductor-on-insulator substrate and including a conductive superlattice. The conductive superlattice may include stacked groups of layers, with each group of layers including stacked doped base semiconductor monolayers defining a doped base semiconductor portion, and at least one non-semiconductor monolayer constrained within a crystal lattice of adjacent doped base semiconductor portions. The method may further include forming a body above the RF ground plane layer, forming spaced apart source and drain regions adjacent the body and defining a channel region in the body, and forming a gate overlying the channel region.
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