- 专利标题： Method of bonding substrates utilizing a substrate holder with holding fingers
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申请号： US18119909申请日： 2023-03-10
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公开(公告)号： US12009231B2公开(公告)日： 2024-06-11
- 发明人: Jun-hyung Kim , Sung-hyup Kim , Tae-yeong Kim
- 申请人： SAMSUNG ELECTRONICS CO., LTD.
- 申请人地址： KR Suwon-si
- 专利权人： SAMSUNG ELECTRONICS CO., LTD.
- 当前专利权人： SAMSUNG ELECTRONICS CO., LTD.
- 当前专利权人地址： KR Suwon-si
- 代理机构： Muir Patent Law, PLLC
- 优先权： KR 20180103029 2018.08.30
- 主分类号： H01L21/67
- IPC分类号： H01L21/67 ; H01L21/66 ; H01L21/673 ; H01L21/687 ; H01L23/00 ; H01L25/00 ; H01L27/146
摘要：
A substrate bonding apparatus includes a substrate susceptor to support a first substrate, a substrate holder over the substrate susceptor to hold a second substrate, the substrate holder including a plurality of independently moveable holding fingers, and a chamber housing to accommodate the substrate susceptor and the substrate holder.
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