- 专利标题: Diamond smoothing method
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申请号: US17263650申请日: 2018-08-01
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公开(公告)号: US11986905B2公开(公告)日: 2024-05-21
- 发明人: Hiroshi Ikenoue , Tsuyoshi Yoshitake , Yuki Katamune , Koki Murasawa
- 申请人: KYUSHU UNIVERSITY, NATIONAL UNIVERSITY CORPORATION , KYUSHU INSTITUTE OF TECHNOLOGY , OSG CORPORATION
- 申请人地址: JP Fukuoka
- 专利权人: KYUSHU UNIVERSITY, NATIONAL UNIVERSITY CORPORATION,KYUSHU INSTITUTE OF TECHNOLOGY,OSG CORPORATION
- 当前专利权人: KYUSHU UNIVERSITY, NATIONAL UNIVERSITY CORPORATION,KYUSHU INSTITUTE OF TECHNOLOGY,OSG CORPORATION
- 当前专利权人地址: JP Fukuoka; JP Kitakyushu; JP Toyokawa
- 代理机构: Oliff PLC
- 国际申请: PCT/JP2018/028944 2018.08.01
- 国际公布: WO2020/026393A 2020.02.06
- 进入国家日期: 2021-01-27
- 主分类号: C30B29/00
- IPC分类号: C30B29/00 ; B23K26/00 ; B23K26/03 ; B23K26/352 ; B23K33/00 ; C30B29/04 ; C30B33/00 ; C30B33/04 ; B23K103/00
摘要:
A diamond smoothing method of irradiating a laser light onto a raised and recessed surface of a diamond, so as to smooth the raised and recessed surface, by ablation that is caused to occur in the diamond by irradiation of the laser light onto the raised and recessed surface. The method includes: a threshold-energy-density detecting step of irradiating the laser light onto the raised and recessed surface, and changing an irradiation energy density of the laser light, so as to detect a threshold energy density as a lower threshold value of the irradiation energy density that causes the ablation to occur; and a smoothing processing step of executing a smoothing processing by irradiating the laser light onto the raised and recessed surface with a smoothing irradiation energy density that is set to be within a range from 1 to 15 times as large as the threshold energy density.
公开/授权文献
- US20210299787A1 DIAMOND SMOOTHING METHOD 公开/授权日:2021-09-30
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