- 专利标题: Semiconductor device and manufacturing method thereof
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申请号: US18039610申请日: 2020-12-01
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公开(公告)号: US11973108B2公开(公告)日: 2024-04-30
- 发明人: Wei Ni , Tetsuya Hayashi , Keiichiro Numakura , Toshiharu Marui , Ryouta Tanaka , Yuichi Iwasaki
- 申请人: NISSAN MOTOR CO., LTD. , RENAULT s.a.s.
- 申请人地址: JP Yokohama
- 专利权人: NISSAN MOTOR CO., LTD.,RENAULT S.A.S.
- 当前专利权人: NISSAN MOTOR CO., LTD.,RENAULT S.A.S.
- 当前专利权人地址: JP Yokohama; FR Boulogne-Billancourt
- 代理机构: Foley & Lardner LLP
- 国际申请: PCT/IB2020/000995 2020.12.01
- 国际公布: WO2022/118055A 2022.06.09
- 进入国家日期: 2023-05-31
- 主分类号: H01L29/06
- IPC分类号: H01L29/06 ; H01L29/16 ; H01L29/423 ; H01L29/66 ; H01L29/78
摘要:
A semiconductor device includes: a drift region that is arranged on a main surface of a substrate, and has a higher impurity concentration than the substrate; a first well region that is connected to the drift region; and a second well region that is arranged adjacent to the first well region and faces the drift region. The second well region has a higher impurity concentration than the first well region. A distance between the source region that faces the drift region via the first well region and the drift region is greater than a distance between the second well region and the drift region, in a direction parallel to the main surface of the substrate. A depletion layer extending from the second well region reaches the drift region.
公开/授权文献
- US20240055475A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF 公开/授权日:2024-02-15
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