- 专利标题： Stretchable substrate having improved stretch uniformity and method of manufacturing the same
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申请号： US17703520申请日： 2022-03-24
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公开(公告)号： US11968778B2公开(公告)日： 2024-04-23
- 发明人: Phillip Lee , SeungJun Chung , HeeSuk Kim , JeongGon Son , SukJoon Hwang
- 申请人： Korea Institute of Science and Technology
- 申请人地址： KR Seoul
- 专利权人： Korea Institute of Science and Technology
- 当前专利权人： Korea Institute of Science and Technology
- 当前专利权人地址： KR Seoul
- 代理机构： Studebaker & Brackett PC
- 优先权： KR 20210193784 2021.12.31
- 主分类号： H05K1/02
- IPC分类号： H05K1/02 ; A41D1/00 ; A41D1/06 ; A41D13/00 ; A41D13/05 ; A42B1/041 ; A42B1/08 ; A42B1/22 ; A43B23/28 ; B32B38/08 ; H05K1/03 ; H05K3/00
摘要：
Disclosed is a method of manufacturing a stretchable substrate having improved stretch uniformity according to various embodiments of the present disclosure in order to implement the above-described object. The method may include forming an auxetic including a plurality of unit structures, and attaching one or more elastic sheets to the auxetic and forming a stretchable substrate.
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