- 专利标题: Gate-all-around integrated circuit structures having insulator FIN on insulator substrate
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申请号: US17727603申请日: 2022-04-22
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公开(公告)号: US11862702B2公开(公告)日: 2024-01-02
- 发明人: Aaron D. Lilak , Rishabh Mehandru , Cory Weber , Willy Rachmady , Varun Mishra
- 申请人: Intel Corporation
- 申请人地址: US CA Santa Clara
- 专利权人: Intel Corporation
- 当前专利权人: Intel Corporation
- 当前专利权人地址: US CA Santa Clara
- 代理机构: Schwabe, Williamson & Wyatt, P.C.
- 主分类号: H01L29/423
- IPC分类号: H01L29/423 ; H01L21/02 ; H01L29/06 ; H01L29/08 ; H01L29/10 ; H01L29/165 ; H01L29/66 ; H01L29/78 ; H01L29/786 ; H01L21/8234
摘要:
Gate-all-around integrated circuit structures having an insulator fin on an insulator substrate, and methods of fabricating gate-all-around integrated circuit structures having an insulator fin on an insulator substrate, are described. For example, an integrated circuit structure includes an insulator fin on an insulator substrate. A vertical arrangement of horizontal semiconductor nanowires is over the insulator fin. A gate stack surrounds a channel region of the vertical arrangement of horizontal semiconductor nanowires, and the gate stack is overlying the insulator fin. A pair of epitaxial source or drain structures is at first and second ends of the vertical arrangement of horizontal semiconductor nanowires and at first and second ends of the insulator fin.
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