- 专利标题: Neighboring gate-all-around integrated circuit structures having disjoined epitaxial source or drain regions
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申请号: US17846439申请日: 2022-06-22
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公开(公告)号: US11862635B2公开(公告)日: 2024-01-02
- 发明人: Leonard P. Guler , Biswajeet Guha , Tahir Ghani , Swaminathan Sivakumar
- 申请人: Intel Corporation
- 申请人地址: US CA Santa Clara
- 专利权人: Intel Corporation
- 当前专利权人: Intel Corporation
- 当前专利权人地址: US CA Santa Clara
- 代理机构: Schwabe, Williamson & Wyatt, P.C.
- 分案原申请号: US16134719 2018.09.18
- 主分类号: H01L27/088
- IPC分类号: H01L27/088 ; H01L21/8234 ; H01L29/06 ; H01L29/08 ; H01L29/423 ; H01L29/66 ; H01L29/78
摘要:
Neighboring gate-all-around integrated circuit structures having disjoined epitaxial source or drain regions, and methods of fabricating neighboring gate-all-around integrated circuit structures having disjoined epitaxial source or drain regions, are described. For example, a structure includes first and second vertical arrangements of nanowires, the nanowires of the second vertical arrangement of nanowires having a horizontal width greater than a horizontal width of the nanowires of the first vertical arrangement of nanowires. First and second gate stacks are over the first and second vertical arrangements of nanowires, respectively. First epitaxial source or drain structures are at ends of the first vertical arrangement of nanowires, and second epitaxial source or drain structures are at ends of the second vertical arrangement of nanowires. An intervening dielectric structure is between neighboring ones of the first epitaxial source or drain structures and of the second epitaxial source or drain structures.
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