Invention Grant
- Patent Title: Coated semiconductor dies
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Application No.: US17003382Application Date: 2020-08-26
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Publication No.: US11837518B2Publication Date: 2023-12-05
- Inventor: Michael Todd Wyant , Matthew John Sherbin , Christopher Daniel Manack , Patrick Francis Thompson , You Chye How
- Applicant: TEXAS INSTRUMENTS INCORPORATED
- Applicant Address: US TX Dallas
- Assignee: Texas Instruments Incorporated
- Current Assignee: Texas Instruments Incorporated
- Current Assignee Address: US TX Dallas
- Agent Yudong Kim; Frank D. Cimino
- Main IPC: H01L23/31
- IPC: H01L23/31 ; H01L23/552 ; H01L21/56 ; H01L21/78 ; H01L21/683
Abstract:
In examples, a chip scale package (CSP) comprises a semiconductor die; a conductive terminal coupled to the semiconductor die; and a non-conductive coat covering a backside of the semiconductor die and a sidewall of the semiconductor die. The non-conductive coat has a thickness of less than 45 microns.
Public/Granted literature
- US20220068744A1 COATED SEMICONDUCTOR DIES Public/Granted day:2022-03-03
Information query
IPC分类:
