- 专利标题: Gate-all-around integrated circuit structures having devices with channel-to-substrate electrical contact
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申请号: US16719222申请日: 2019-12-18
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公开(公告)号: US11824116B2公开(公告)日: 2023-11-21
- 发明人: Biswajeet Guha , William Hsu , Chung-Hsun Lin , Kinyip Phoa , Oleg Golonzka , Ayan Kar , Nicholas Thomson , Benjamin Orr , Nathan Jack , Kalyan Kolluru , Tahir Ghani
- 申请人: Intel Corporation
- 申请人地址: US CA Santa Clara
- 专利权人: Intel Corporation
- 当前专利权人: Intel Corporation
- 当前专利权人地址: US CA Santa Clara
- 代理机构: Schwabe, Williamson & Wyatt, P.C.
- 主分类号: H01L29/78
- IPC分类号: H01L29/78 ; H01L29/423 ; H01L29/06 ; H01L29/417
摘要:
Gate-all-around integrated circuit structures having devices with channel-to-substrate electrical contact are described. For example, an integrated circuit structure includes a first vertical arrangement of horizontal nanowires above a first fin. A channel region of the first vertical arrangement of horizontal nanowires is electrically coupled to the first fin by a semiconductor material layer directly between the first vertical arrangement of horizontal nanowires and the first fin. A first gate stack is over the first vertical arrangement of horizontal nanowires. A second vertical arrangement of horizontal nanowires is above a second fin. A channel region of the second vertical arrangement of horizontal nanowires is electrically isolated from the second fin. A second gate stack is over the second vertical arrangement of horizontal nanowires.
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