Invention Grant
- Patent Title: Semiconductor device
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Application No.: US17325466Application Date: 2021-05-20
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Publication No.: US11804528B2Publication Date: 2023-10-31
- Inventor: Sang Young Kim , Byung Chan Ryu , Da Un Jeon
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Lee IP Law, P.C.
- Priority: KR 20200116578 2020.09.11
- Main IPC: H01L29/417
- IPC: H01L29/417 ; H01L23/522 ; H01L29/45 ; H01L29/423 ; H01L23/528 ; H01L23/532 ; H01L29/786

Abstract:
A semiconductor device includes a substrate, a gate structure on the substrate, a source/drain pattern on the substrate, the source/drain pattern being at a side of the gate structure, a source/drain contact filling on and connected to the source/drain pattern, an entire top surface of the source/drain contact filling being lower than a top surface of the gate structure, and a connection contact directly on and connected to the source/drain contact filling, a top surface of the connection contact being higher than the top surface of the gate structure.
Public/Granted literature
- US20220085179A1 SEMICONDUCTOR DEVICE Public/Granted day:2022-03-17
Information query
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