- 专利标题: Semiconductor structure and associated fabricating method
-
申请号: US17103611申请日: 2020-11-24
-
公开(公告)号: US11721758B2公开(公告)日: 2023-08-08
- 发明人: Jia-Rui Lee , Kuo-Ming Wu , Yi-Chun Lin
- 申请人: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- 申请人地址: TW Hsinchu
- 专利权人: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- 当前专利权人: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- 当前专利权人地址: TW Hsinchu
- 代理机构: WPAT Law
- 代理商 Anthony King
- 分案原申请号: US15719500 2017.09.28
- 主分类号: H01L29/78
- IPC分类号: H01L29/78 ; H01L21/762 ; H01L29/06 ; H01L29/423 ; H01L21/76 ; H01L29/66
摘要:
A semiconductor structure is disclosed. The semiconductor structure includes: a substrate; an isolation region adjacent to the drain region; a gate electrode over the substrate and further downwardly extends into the substrate, wherein a portion of the gate electrode below a top surface of the substrate abuts the isolation region; and a source region and a drain region formed in the substrate on either side of the gate structure. An associated method for fabricating the semiconductor structure is also disclosed.
公开/授权文献
信息查询
IPC分类: