Invention Grant
- Patent Title: Semiconductor device and method
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Application No.: US17189779Application Date: 2021-03-02
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Publication No.: US11688786B2Publication Date: 2023-06-27
- Inventor: Hsin-Yi Lee , Cheng-Lung Hung , Chi On Chui
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Slater Matsil, LLP
- Main IPC: H01L29/49
- IPC: H01L29/49 ; H01L27/092 ; H01L29/06 ; H01L29/423 ; H01L29/45 ; H01L29/786 ; H01L21/02 ; H01L21/28 ; H01L21/285 ; H01L21/8238 ; H01L29/66

Abstract:
In an embodiment, a device includes: a first channel region; a second channel region; and a gate structure around the first channel region and the second channel region, the gate structure including: a gate dielectric layer; a first p-type work function metal on the gate dielectric layer, the first p-type work function metal including fluorine and aluminum; a second p-type work function metal on the first p-type work function metal, the second p-type work function metal having a lower concentration of fluorine and a lower concentration of aluminum than the first p-type work function metal; and a fill layer on the second p-type work function metal.
Public/Granted literature
- US20220238686A1 Semiconductor Device and Method Public/Granted day:2022-07-28
Information query
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