公开(公告)号：US20240379448A1

公开(公告)日：2024-11-14

申请号：US18783632

申请日：2024-07-25

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Hsin-Han Tsai ,  Chung-Chiang Wu ,  Cheng-Lung Hung ,  Weng Chang ,  Chi On Chui

IPC: H01L21/8234 ,  H01L21/28 ,  H01L27/088 ,  H01L29/49

Abstract: A method includes forming a gate dielectric on a semiconductor region, depositing a work-function layer over the gate dielectric, depositing a silicon layer over the work-function layer, and depositing a glue layer over the silicon layer. The work-function layer, the silicon layer, and the glue layer are in-situ deposited. The method further includes depositing a filling-metal over the glue layer; and performing a planarization process, wherein remaining portions of the glue layer, the silicon layer, and the work-function layer form portions of a gate electrode.

公开(公告)号：US12132112B2

公开(公告)日：2024-10-29

申请号：US17875561

申请日：2022-07-28

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd

Inventor： Hsin-Yi Lee ,  Cheng-Lung Hung ,  Ji-Cheng Chen ,  Weng Chang ,  Chi On Chui

IPC: H01L29/78 ,  H01L29/417 ,  H01L29/66

CPC classification number: H01L29/785 ,  H01L29/41791 ,  H01L29/66795 ,  H01L2029/7858

Abstract: A semiconductor device with different gate structure configurations and a method of fabricating the same are disclosed. The semiconductor device includes a fin structure disposed on a substrate, a nanostructured channel region disposed on the fin structure, and a gate-all-around (GAA) structure surrounding the nanostructured channel region. The GAA structure includes a high-K (HK) gate dielectric layer with a metal doped region having dopants of a first metallic material, a p-type work function metal (pWFM) layer disposed on the HK gate dielectric layer, a bimetallic nitride layer interposed between the HK gate dielectric layer and the pWFM layer, an n-type work function metal (nWFM) layer disposed on the pWFM layer, and a gate metal fill layer disposed on the nWFM layer. The pWFM layer includes a second metallic material and the bimetallic nitride layer includes the first and second metallic materials.

公开(公告)号：US20240347392A1

公开(公告)日：2024-10-17

申请号：US18753130

申请日：2024-06-25

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Hsin-Yi Lee ,  Cheng-Lung Hung ,  Chi On Chui

IPC: H01L21/8238 ,  H01L21/285 ,  H01L27/092 ,  H01L29/49

CPC classification number: H01L21/823842 ,  H01L27/0924 ,  H01L29/4966 ,  H01L21/28568

Abstract: A method includes depositing a first conductive layer over a gate dielectric layer; depositing a first work function tuning layer over the first conductive layer; selectively removing the first work function tuning layer from over a first region of the first conductive layer; doping the first work function tuning layer with a dopant; and after doping the first work function tuning layer performing a first treatment process to etch the first region of the first conductive layer and a second region of the first work function tuning layer. The first treatment process etches the first conductive layer at a greater rate than the first work function tuning layer.

公开(公告)号：US12068388B2

公开(公告)日：2024-08-20

申请号：US17676380

申请日：2022-02-21

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Hsin-Yi Lee ,  Hsuan-Yu Tung ,  Chin-You Hsu ,  Cheng-Lung Hung

IPC: H01L29/49 ,  H01L21/28 ,  H01L21/8234 ,  H01L27/088 ,  H01L29/06 ,  H01L29/66 ,  H01L29/78

CPC classification number: H01L29/4966 ,  H01L21/28088 ,  H01L21/28247 ,  H01L21/823431 ,  H01L21/82345 ,  H01L21/823468 ,  H01L27/0886 ,  H01L29/0649 ,  H01L29/66545 ,  H01L29/66795 ,  H01L29/785

Abstract: Semiconductor devices and methods of manufacturing semiconductor devices are provided. In embodiments a passivation process is utilized in order to reduce dangling bonds and defects within work function layers within a gate stack. The passivation process introduces a passivating element which will react with the dangling bonds to passivate the dangling bonds. Additionally, in some embodiments the passivating elements will trap other elements and reduce or prevent them from diffusing into other portions of the structure.

公开(公告)号：US20240154016A1

公开(公告)日：2024-05-09

申请号：US18414753

申请日：2024-01-17

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Hsin-Yi Lee ,  Ji-Cheng Chen ,  Cheng-Lung Hung ,  Chi On Chui

IPC: H01L29/423 ,  H01L29/40 ,  H01L29/66 ,  H01L29/78

CPC classification number: H01L29/42392 ,  H01L29/401 ,  H01L29/6681 ,  H01L29/7853 ,  H01L29/0673

Abstract: A device includes a first nanostructure; a second nanostructure over the first nanostructure; a first high-k gate dielectric disposed around the first nanostructure; a second high-k gate dielectric being disposed around the second nanostructure; and a gate electrode over the first high-k gate dielectric and the second high-k gate dielectric. A portion of the gate electrode between the first nanostructure and the second nanostructure comprises a first portion of a p-type work function metal filling an area between the first high-k gate dielectric and the second high-k gate dielectric.

公开(公告)号：US20230387202A1

公开(公告)日：2023-11-30

申请号：US18359695

申请日：2023-07-26

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Hsin-Yi Lee ,  Cheng-Lung Hung ,  Chi On Chui

IPC: H01L29/06 ,  H01L27/092

CPC classification number: H01L29/0673 ,  H01L27/0924

Abstract: An embodiment includes a device having nanostructures on a substrate, the nanostructures including a channel region. The device also includes a gate dielectric layer wrapping around each of the nanostructures. The device also includes a first work function tuning layer on the gate dielectric layer, the first work function tuning layer including a first n-type work function metal, aluminum, and carbon, the first n-type work function metal having a work function value less than titanium. The device also includes a glue layer on the first work function tuning layer. The device also includes and a fill layer on the glue layer.

公开(公告)号：US20230261051A1

公开(公告)日：2023-08-17

申请号：US18302132

申请日：2023-04-18

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Hsin-Yi Lee ,  Cheng-Lung Hung ,  Chi On Chui

IPC: H01L29/06 ,  H01L29/78 ,  H01L29/66 ,  H01L27/092

CPC classification number: H01L29/0673 ,  H01L29/7851 ,  H01L29/66795 ,  H01L27/0924

Abstract: In an embodiment, a device includes: a channel region; a gate dielectric layer on the channel region; a first work function tuning layer on the gate dielectric layer, the first work function tuning layer including a p-type work function metal; a barrier layer on the first work function tuning layer; a second work function tuning layer on the barrier layer, the second work function tuning layer including a n-type work function metal, the n-type work function metal different from the p-type work function metal; and a fill layer on the second work function tuning layer.

公开(公告)号：US11728341B2

公开(公告)日：2023-08-15

申请号：US17656295

申请日：2022-03-24

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chung-Chiang Wu ,  Shih-Hang Chiu ,  Chih-Chang Hung ,  I-Wei Yang ,  Shu-Yuan Ku ,  Cheng-Lung Hung ,  Da-Yuan Lee ,  Ching-Hwanq Su

IPC: H01L27/088 ,  H01L29/06 ,  H01L21/8234 ,  H01L29/66 ,  H10B10/00

CPC classification number: H01L27/0886 ,  H01L21/823431 ,  H01L21/823481 ,  H01L29/0649 ,  H01L29/66545 ,  H10B10/12

Abstract: A method includes forming a first semiconductor fin in a substrate, forming a metal gate structure over the first semiconductor fin, removing a portion of the metal gate structure to form a first recess in the metal gate structure that is laterally separated from the first semiconductor fin by a first distance, wherein the first distance is determined according to a first desired threshold voltage associated with the first semiconductor fin, and filling the recess with a dielectric material.

公开(公告)号：US11688786B2

公开(公告)日：2023-06-27

申请号：US17189779

申请日：2021-03-02

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Hsin-Yi Lee ,  Cheng-Lung Hung ,  Chi On Chui

IPC: H01L29/49 ,  H01L27/092 ,  H01L29/06 ,  H01L29/423 ,  H01L29/45 ,  H01L29/786 ,  H01L21/02 ,  H01L21/28 ,  H01L21/285 ,  H01L21/8238 ,  H01L29/66

CPC classification number: H01L29/4908 ,  H01L21/02603 ,  H01L21/28088 ,  H01L21/28518 ,  H01L21/823807 ,  H01L21/823814 ,  H01L21/823842 ,  H01L21/823864 ,  H01L21/823871 ,  H01L27/092 ,  H01L29/0673 ,  H01L29/42392 ,  H01L29/45 ,  H01L29/66545 ,  H01L29/66553 ,  H01L29/66742 ,  H01L29/78696

Abstract: In an embodiment, a device includes: a first channel region; a second channel region; and a gate structure around the first channel region and the second channel region, the gate structure including: a gate dielectric layer; a first p-type work function metal on the gate dielectric layer, the first p-type work function metal including fluorine and aluminum; a second p-type work function metal on the first p-type work function metal, the second p-type work function metal having a lower concentration of fluorine and a lower concentration of aluminum than the first p-type work function metal; and a fill layer on the second p-type work function metal.

公开(公告)号：US20220367263A1

公开(公告)日：2022-11-17

申请号：US17869462

申请日：2022-07-20

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chung-Chiang Wu ,  Hsueh Wen Tsau ,  Chia-Ching Lee ,  Cheng-Lung Hung ,  Ching-Hwanq Su

IPC: H01L21/768 ,  H01L29/66 ,  H01L23/532 ,  H01L29/78 ,  H01L23/535

Abstract: A method includes forming an opening in a dielectric layer, depositing a seed layer in the opening, wherein first portions of the seed layer have a first concentration of impurities, exposing the first portions of the seed layer to a plasma, wherein after exposure to the plasma the first portions have a second concentration of impurities that is less than the first concentration of impurities, and filling the opening with a conductive material to form a conductive feature. In an embodiment, the seed layer includes tungsten, and the conductive material includes tungsten. In an embodiment, the impurities include boron.