- Patent Title: Interconnection structure fabrication using grayscale lithography
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Application No.: US17375360Application Date: 2021-07-14
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Publication No.: US11664303B2Publication Date: 2023-05-30
- Inventor: Johanna Swan , Henning Braunisch , Aleksandar Aleksov , Shawna Liff , Brandon Rawlings , Veronica Strong
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Essential Patents Group, LLP
- The original application number of the division: US16564168 2019.09.09
- Main IPC: H01L23/498
- IPC: H01L23/498 ; G03F1/38 ; G03F1/54 ; G03F1/68

Abstract:
An lithographic reticle may be formed comprising a transparent substrate, a substantially opaque mask formed on the transparent substrate that defines at least one exposure window, wherein the at least one exposure window has a first end, a first filter formed on the transparent substrate within the at least one exposure window and abutting the first end thereof, and a second filter formed on the transparent substrate within the at least one exposure window and abutting the first filter, wherein an average transmissivity of the first filter is substantially one half of a transmissivity of the second filter. In another embodiment, the at least one exposure window includes a third filter abutting the second end and is adjacent the second filter. Further embodiments of the present description include interconnection structures and systems fabricated using the lithographic reticle.
Public/Granted literature
- US20210343635A1 INTERCONNECTION STRUCTURE FABRICATION USING GRAYSCALE LITHOGRAPHY Public/Granted day:2021-11-04
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