- 专利标题: Ion milling device and ion milling method
-
申请号: US16077782申请日: 2016-02-26
-
公开(公告)号: US11621141B2公开(公告)日: 2023-04-04
- 发明人: Toru Iwaya , Hisayuki Takasu , Sakae Koubori
- 申请人: Hitachi High-Technologies Corporation
- 申请人地址: JP Tokyo
- 专利权人: Hitachi High-Technologies Corporation
- 当前专利权人: Hitachi High-Technologies Corporation
- 当前专利权人地址: JP Tokyo
- 代理机构: Crowell & Moring LLP
- 国际申请: PCT/JP2016/055868 WO 20160226
- 国际公布: WO2017/145371 WO 20170831
- 主分类号: H01J37/20
- IPC分类号: H01J37/20 ; H01J37/305 ; H01J37/08 ; H01J37/26 ; H01J37/304 ; H01J37/30
摘要:
Provided is a machining technology to obtain a desired machining content while suppressing a possibility of causing a redeposition in a machining surface. The invention is directed to provide an ion milling device which includes an ion source which emits an ion beam, a sample holder which holds a sample, and a sample sliding mechanism which slides the sample holder in a direction including a normal direction of an axis of the ion beam.
公开/授权文献
- US20210193430A1 Ion Milling Device and Ion Milling Method 公开/授权日:2021-06-24
信息查询