Invention Grant
- Patent Title: Circuit board including insulating layer having a plurality of dielectrics with different dielectric loss, and electronic device including the circuit board
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Application No.: US16460937Application Date: 2019-07-02
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Publication No.: US11605891B2Publication Date: 2023-03-14
- Inventor: Sungwon Park , Dongil Son , Sangwon Ha
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Priority: KR10-2018-0076370 20180702
- Main IPC: H01Q9/04
- IPC: H01Q9/04 ; H05K1/02 ; H05K1/11

Abstract:
An electronic device includes a communication circuit electrically connected with a circuit board. The circuit board includes a first portion comprising a first layered structure in which a wiring layer and a first insulating layer are alternately positioned, and a second portion comprising a second layered structure in which the wiring layer and the first insulating layer are alternately positioned and a second insulating layer. At least one antenna patch is positioned on or within the second insulating layer. A conductive line penetrates the second layered structure and the second insulating layer and electrically connects the at least one antenna patch and the communication circuit. The first insulating layer has a first loss tangent value, and the second insulating layer has a second loss tangent value smaller than the first loss tangent value.
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