- 专利标题: Surface topography measurement apparatus and method
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申请号: US17747639申请日: 2022-05-18
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公开(公告)号: US11604151B2公开(公告)日: 2023-03-14
- 发明人: Weimin Li , Wen Xiao , Vibhu Jindal , Sanjay Bhat
- 申请人: Applied Materials, Inc.
- 申请人地址: US CA Santa Clara
- 专利权人: Applied Materials, Inc.
- 当前专利权人: Applied Materials, Inc.
- 当前专利权人地址: US CA Santa Clara
- 代理机构: Servilla Whitney LLC
- 主分类号: G01N21/956
- IPC分类号: G01N21/956 ; G03F7/20 ; G03F1/24
摘要:
Apparatus and methods for measuring surface topography are described. The analysis apparatus and methods detect light reflected from the reflective backside of a cantilever assembly including a tip, calculate a background level (BGL) value obtained from an optical scan of a reference sample using a power spectral density (PSD) value obtained from a topographical scan of a reference sample to generate a correlational coefficient between the BGL and the PSD values. The correlational coefficient between the BGL and PSD values is used to measure the BGL value of additional EUV mask blanks by a topographical scan of the EUV mask blanks using the same tip mounted to the cantilever.
公开/授权文献
- US20220283100A1 Surface Topography Measurement Apparatus And Method 公开/授权日:2022-09-08
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