- 专利标题: Radiation-sensitive resin composition, resist pattern-forming method, compound and method of generating acid
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申请号: US16815075申请日: 2020-03-11
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公开(公告)号: US11592746B2公开(公告)日: 2023-02-28
- 发明人: Kazuya Kiriyama , Katsuaki Nishikori , Takuhiro Taniguchi , Ken Maruyama
- 申请人: JSR CORPORATION
- 申请人地址: JP Tokyo
- 专利权人: JSR CORPORATION
- 当前专利权人: JSR CORPORATION
- 当前专利权人地址: JP Tokyo
- 代理机构: Element IP, PLC
- 优先权: JPJP2019-083410 20190424
- 主分类号: C07C309/06
- IPC分类号: C07C309/06 ; G03F7/039 ; G03F7/004 ; C08L25/06 ; C08L33/06 ; C07C309/12
摘要:
A radiation-sensitive resin composition contains: a polymer that includes a structural unit including an acid-labile group; and a radiation-sensitive acid generating agent. The radiation-sensitive acid generating agent includes a sulfonate anion and a radiation-sensitive cation. The sulfonate anion includes two or more rings, and an iodine atom and a monovalent group having 0 to 10 carbon atoms which includes at least one of an oxygen atom and a nitrogen atom bond to at least one of the two or more rings. The ring is preferably an aromatic ring. The radiation-sensitive acid generating agent is preferably a compound represented by formula (1). In the formula (1), A1 represents a group obtained from a compound which includes a ring having 3 to 20 ring atoms by removing (p+q+r+1) hydrogen atoms on the ring.
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