A circuit board with conductive wiring which is precisely shaped and sized includes a two-part conductive element, namely a first conductive wiring layer and a second conductive wiring layer, a first cover film and a second cover film. The first conductive wiring layer and the second conductive wiring layer are in direct contact to each other. A projection of the first conductive wiring layer and a projection of the second conductive wiring layer along a direction perpendicular to the circuit board overlap with each other. The first and the second cover films wrap the first and the second conductive wiring layers, respectively.