- 专利标题： Package integration using fanout cavity substrate
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申请号： US17026708申请日： 2020-09-21
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公开(公告)号： US11532563B2公开(公告)日： 2022-12-20
- 发明人: Karthik Shanmugam , Jun Zhai , Rajasekaran Swaminathan
- 申请人： Apple Inc.
- 申请人地址： US CA Cupertino
- 专利权人： Apple Inc.
- 当前专利权人： Apple Inc.
- 当前专利权人地址： US CA Cupertino
- 代理机构： Aikin & Gallant, LLP
- 主分类号： H01L23/538
- IPC分类号： H01L23/538 ; H01L23/31 ; H05K1/18 ; H01L21/56 ; H01L25/16
摘要：
Packages and packaging techniques are described in which a patterned carrier substrate can be used to create a reconstituted fanout substrate with a topography that can accommodate components of different thicknesses. In an embodiment, a wiring layer is formed directly on a multiple level topography of a molding compound layer including embedded components.
公开/授权文献
- US20220093522A1 PACKAGE INTEGRATION USING FANOUT CAVITY SUBSTRATE 公开/授权日：2022-03-24
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