公开(公告)号：US11532563B2

公开(公告)日：2022-12-20

申请号：US17026708

申请日：2020-09-21

Applicant: Apple Inc.

Inventor： Karthik Shanmugam ,  Jun Zhai ,  Rajasekaran Swaminathan

IPC: H01L23/538 ,  H01L23/31 ,  H05K1/18 ,  H01L21/56 ,  H01L25/16

Abstract: Packages and packaging techniques are described in which a patterned carrier substrate can be used to create a reconstituted fanout substrate with a topography that can accommodate components of different thicknesses. In an embodiment, a wiring layer is formed directly on a multiple level topography of a molding compound layer including embedded components.

公开(公告)号：US20220093522A1

公开(公告)日：2022-03-24

申请号：US17026708

申请日：2020-09-21

Applicant: Apple Inc.

Inventor： Karthik Shanmugam ,  Jun Zhai ,  Rajasekaran Swaminathan

IPC: H01L23/538 ,  H01L23/31 ,  H05K1/18 ,  H01L25/16 ,  H01L21/56

Abstract: Packages and packaging techniques are described in which a patterned carrier substrate can be used to create a reconstituted fanout substrate with a topography that can accommodate components of different thicknesses. In an embodiment, a wiring layer is formed directly on a multiple level topography of a molding compound layer including embedded components.