A method for forming an antislip material. A flexible thermoplastic carrier is provided. A hot release surface is provided. Provided is a first layer of discrete thermoplastic particles, sifting on the hot release surface. The discrete particles are above their softening temperatures, providing in the first layer a tackiness. The method includes contacting the carrier with the tacky first layer for sticking the first layer to the carrier, and thereafter removing the carrier, and therewith the tacky first layer stuck to the carrier, from the release surface. Thereby the carrier is provided with a hot, preferably discontinuous and/or elastomeric antislip coating. With a heat energy of the hot coating a bond is formed between the carrier and the coating. The removing of the carrier includes pulling the carrier out of the contact with a pulling-out force. The temperature of the hot release surface is above the melting temperature of the carrier. The carrier would be spoiled, if heated completely to the temperature of the release surface and simultaneously pulled with the pulling-out force. Therefore the contacting time is kept shorter than a minimum time required by a heat of the hot release surface for spoiling the carrier. Flat-topped roughening projections can be included in the antislip coating.