- 专利标题： Substrate processing system and method for supplying processing fluid
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申请号： US16578587申请日： 2019-09-23
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公开(公告)号： US11482427B2公开(公告)日： 2022-10-25
- 发明人: Yasuo Kiyohara , Hiroaki Inadomi , Satoshi Okamura
- 申请人： Tokyo Electron Limited
- 申请人地址： JP Tokyo
- 专利权人： Tokyo Electron Limited
- 当前专利权人： Tokyo Electron Limited
- 当前专利权人地址： JP Tokyo
- 代理机构： Venjuris, P.C.
- 优先权： JPJP2018-180303 20180926
- 主分类号： H01L21/67
- IPC分类号： H01L21/67 ; B08B3/10 ; B08B5/00 ; H01L21/677
摘要：
A substrate processing system includes: a substrate processing apparatus configured to process a substrate with a processing fluid; and a processing fluid supply apparatus configured to supply the processing fluid to the substrate processing apparatus. The processing fluid supply apparatus includes: a circulation line, a gas supply line, a cooler, a pump, a branch line, a heating unit, and a pressure regulator.
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