- 专利标题: Multilayer capacitor and board having the same mounted thereon
-
申请号: US17233235申请日: 2021-04-16
-
公开(公告)号: US11469051B2公开(公告)日: 2022-10-11
- 发明人: Ji Hye Han , Jung Min Kim , Jae Seok Yi , Hye Jin Park , Byung Woo Kang , Jeong Ryeol Kim , Bon Seok Koo , Il Ro Lee
- 申请人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 申请人地址: KR Suwon-si
- 专利权人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人地址: KR Suwon-si
- 代理机构: Morgan, Lewis & Bockius LLP
- 优先权: KR10-2020-0124224 20200924
- 主分类号: H01G4/30
- IPC分类号: H01G4/30 ; H01G4/012 ; H05K1/18 ; H01G4/12 ; H01G4/248
摘要:
A multilayer capacitor includes a capacitor body including first to six surfaces, and including a dielectric layer, first and second internal electrodes, and first and second external electrodes. The first and second external electrodes include first and second sintered layers, and first and second plating layers, respectively. An insulating layer is disposed on the capacitor body, to cover an end portion of a first band portion of the first sintered layer and an end portion of a second band portion of the second sintered layer, and has a maximum thickness of 10 μm or more. A portion of the first band portion of the first sintered layer is exposed from the insulating layer. A portion of the second band portion of the second sintered layer is exposed from the insulating layer.
公开/授权文献
信息查询