Invention Grant
- Patent Title: Micro-trenching mold interface in a pop package
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Application No.: US16049696Application Date: 2018-07-30
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Publication No.: US11462527B2Publication Date: 2022-10-04
- Inventor: Kumar Abhishek Singh , Zhaozhi Li , Thomas J. Debonis , Robert Nickerson , Rees Winters
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt, P.C.
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L25/18 ; H01L23/31 ; H01L21/56 ; H01L21/48 ; H01L23/544 ; H01L25/00
Abstract:
Embodiments disclosed herein include an electronics package. In an embodiment, the electronics package comprises a package substrate and a die on the package substrate. In an embodiment, a mold layer is positioned over the package substrate. In an embodiment, the electronics package further comprises through-mold interconnects through the mold layer, and a trench that extends at least partially into the mold layer.
Public/Granted literature
- US20200035658A1 MICRO-TRENCHING MOLD INTERFACE IN A POP PACKAGE Public/Granted day:2020-01-30
Information query
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