公开(公告)号：US11462527B2

公开(公告)日：2022-10-04

申请号：US16049696

申请日：2018-07-30

Applicant: Intel Corporation

Inventor： Kumar Abhishek Singh ,  Zhaozhi Li ,  Thomas J. Debonis ,  Robert Nickerson ,  Rees Winters

IPC: H01L23/48 ,  H01L25/18 ,  H01L23/31 ,  H01L21/56 ,  H01L21/48 ,  H01L23/544 ,  H01L25/00

Abstract: Embodiments disclosed herein include an electronics package. In an embodiment, the electronics package comprises a package substrate and a die on the package substrate. In an embodiment, a mold layer is positioned over the package substrate. In an embodiment, the electronics package further comprises through-mold interconnects through the mold layer, and a trench that extends at least partially into the mold layer.