- 专利标题: Structure and formation method of semiconductor device with metal gate stack
-
申请号: US16943672申请日: 2020-07-30
-
公开(公告)号: US11417745B2公开(公告)日: 2022-08-16
- 发明人: Jia-Chuan You , Huan-Chieh Su , Kuo-Cheng Chiang , Chih-Hao Wang
- 申请人: Taiwan Semiconductor Manufacturing Co., Ltd.
- 申请人地址: TW Hsinchu
- 专利权人: Taiwan Semiconductor Manufacturing Co., Ltd.
- 当前专利权人: Taiwan Semiconductor Manufacturing Co., Ltd.
- 当前专利权人地址: TW Hsinchu
- 代理机构: Birch, Stewart, Kolasch & Birch, LLP
- 主分类号: H01L29/423
- IPC分类号: H01L29/423 ; H01L21/8234 ; H01L27/088 ; H01L29/66 ; H01L29/78
摘要:
A semiconductor device structure and the fabrication method are provided. The semiconductor device structure includes a first channel structure and a second channel structure over a substrate. The second channel structure is longer than the first channel structure. The semiconductor device structure also includes a first gate stack over the first channel structure, and the first gate stack has a first width. The semiconductor device structure further includes a first gate spacer extending along a sidewall of the first gate stack. In addition, the semiconductor device structure includes a second gate stack over the second channel structure and a second gate spacer extending along a sidewall of the second gate stack. The second gate stack has a portion extending along the second gate spacer, and the portion of the second gate stack has a second width. Half of the first width is greater than the second width.
公开/授权文献
信息查询
IPC分类: