- 专利标题: Dielectric structure applied to building components for increasing transmittance of RF signal and disposing method thereof
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申请号: US17093956申请日: 2020-11-10
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公开(公告)号: US11349221B2公开(公告)日: 2022-05-31
- 发明人: Hsien-Chiung Fu , Ming Lu , Yat Tung Ng
- 申请人: Hsien-Chiung Fu
- 申请人地址: TW New Taipei
- 专利权人: Hsien-Chiung Fu
- 当前专利权人: Hsien-Chiung Fu
- 当前专利权人地址: TW New Taipei
- 代理机构: Snyder, Clark, Lesch & Chung, LLP
- 主分类号: H01Q15/00
- IPC分类号: H01Q15/00 ; H01Q1/38 ; H01Q1/42
摘要:
A dielectric structure applied to building components for increasing a transmittance of an RF signal is provided. The dielectric structure includes a structural body and a fixing component. The structural body includes at least one dielectric material layer, and a dielectric constant of each dielectric material layer is between 1 and 10,000. The fixing component joins the structural body and a joining component. A composite structure after the dielectric structure and building components are joined may have the RF signal of the working frequency f0 pass and reduce the reflection loss. The minimum equivalent diameter of a projection plane on a surface of the joining component of the dielectric structure on a surface through which an RF signal passes is no less than one-eighth of a working wavelength λ0 corresponding to the working frequency f0.
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