Invention Grant
- Patent Title: Thin film transistor and method for manufacturing a thin film transistor
-
Application No.: US16642638Application Date: 2019-03-04
-
Publication No.: US11309427B2Publication Date: 2022-04-19
- Inventor: Zhi Wang , Guangcai Yuan , Feng Guan , Chen Xu , Xueyong Wang , Jianhua Du , Chao Li , Lei Chen
- Applicant: BOE TECHNOLOGY GROUP CO., LTD.
- Applicant Address: CN Beijing
- Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee Address: CN Beijing
- Agency: Armstrong Teasdale LLP
- International Application: PCT/CN2019/076870 WO 20190304
- International Announcement: WO2020/177056 WO 20200910
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/786 ; H01L29/66

Abstract:
The present disclosure relates to a thin film transistor and a manufacturing method thereof. The thin film transistor includes a substrate, a first semiconductor layer, a gate dielectric layer, and a gate electrode sequentially stacked on the substrate, the first semiconductor layer has a first portion located in a channel region of the thin film transistor and a second portion in source/drain regions of the thin film transistor and located on both sides of the first portion, the second portion and first sub-portions of the first portion adjacent to the second portion include an amorphous semiconductor material, a second sub-portion of the first portion between the first sub-portions includes a polycrystalline semiconductor material, and a second semiconductor layer located in the source/drain regions and in contact with the second portion, wherein a conductivity of the second semiconductor layer is higher than a conductivity of the amorphous semiconductor material.
Public/Granted literature
- US20210151605A1 THIN FILM TRANSISTOR AND METHOD FOR MANUFACTURING A THIN FILM TRANSISTOR Public/Granted day:2021-05-20
Information query
IPC分类: