Invention Grant
- Patent Title: Semiconductor device
-
Application No.: US16702884Application Date: 2019-12-04
-
Publication No.: US11309312B2Publication Date: 2022-04-19
- Inventor: Shing-Yih Shih
- Applicant: NANYA TECHNOLOGY CORPORATION
- Applicant Address: TW New Taipei
- Assignee: NANYA TECHNOLOGY CORPORATION
- Current Assignee: NANYA TECHNOLOGY CORPORATION
- Current Assignee Address: TW New Taipei
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Main IPC: H01L27/108
- IPC: H01L27/108 ; G11C5/06 ; H01L27/11573 ; H01L27/11582

Abstract:
The present application discloses a semiconductor device and a method for fabricating the semiconductor device. The semiconductor device includes a substrate including a center area and a peripheral area surrounding the center area, a first gate stack positioned on the peripheral area of the substrate, and an active column positioned in the center area of the substrate. A top surface of the first gate stack and a top surface of the active column are at a same vertical level.
Public/Granted literature
- US20210175236A1 SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME Public/Granted day:2021-06-10
Information query
IPC分类: