发明授权
- 专利标题： Electronic package
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申请号： US16859009申请日： 2020-04-27
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公开(公告)号： US11289794B2公开(公告)日： 2022-03-29
- 发明人: Rung-Jeng Lin , Han-Hung Chen , Shi-Min Zhou , Kuo-Hua Yu , Chang-Fu Lin
- 申请人： SILICONWARE PRECISION INDUSTRIES CO., LTD.
- 申请人地址： TW Taichung
- 专利权人： SILICONWARE PRECISION INDUSTRIES CO., LTD.
- 当前专利权人： SILICONWARE PRECISION INDUSTRIES CO., LTD.
- 当前专利权人地址： TW Taichung
- 代理机构： Kelly & Kelley, LLP
- 优先权： TW108148637 20191231
- 主分类号： H05K7/00
- IPC分类号： H05K7/00 ; H01Q1/22 ; H01L23/498 ; H01L23/00 ; H01L23/66
摘要：
An electronic package is disclosed. An antenna board is stacked on a circuit board. A frame is formed on the circuit board. A supporter disposed between the antenna board and the circuit board is secured in the frame. In a packaging process, the frame ensures that the antenna board and the circuit board are separated at a distance that complies with a requirement, and that the antenna function of the antenna board can function normally.
公开/授权文献
- US20210203057A1 ELECTRONIC PACKAGE 公开/授权日：2021-07-01
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