Invention Grant
- Patent Title: Methods of forming stretchable encapsulation for electronic displays
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Application No.: US16698835Application Date: 2019-11-27
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Publication No.: US11258045B2Publication Date: 2022-02-22
- Inventor: Kyuil Cho , Byung Sung Kwak , Robert Jan Visser
- Applicant: Applied Materials, Inc
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc
- Current Assignee: Applied Materials, Inc
- Current Assignee Address: US CA Santa Clara
- Agency: Fish & Richardson P.C.
- Main IPC: H01L51/52
- IPC: H01L51/52 ; H01L51/56 ; H01L27/32

Abstract:
A method of encapsulating an organic light-emitting diode display includes depositing a plurality of first polymer projections onto a light-emitting side of a display layer having a plurality of organic light-emitting diodes (OLEDs) such that the plurality of first polymer projections have spaces therebetween that expose an underlying surface, and conformally coating the first polymer projections and the spaces between the first polymer projections with a first dielectric layer such that the first dielectric layer has side walls along sides of the first polymer projections and defines wells in spaces between the side walls.
Public/Granted literature
- US20210159459A1 METHODS OF FORMING STRETCHABLE ENCAPSULATION FOR ELECTRONIC DISPLAYS Public/Granted day:2021-05-27
Information query
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