- 专利标题: Acoustic wave device with spinel layer and temperature compensation layer
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申请号: US16923757申请日: 2020-07-08
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公开(公告)号: US11245378B2公开(公告)日: 2022-02-08
- 发明人: Gong Bin Tang , Rei Goto , Hiroyuki Nakamura , Keiichi Maki
- 申请人: Skyworks Solutions, Inc.
- 申请人地址: US CA Irvine
- 专利权人: Skyworks Solutions, Inc.
- 当前专利权人: Skyworks Solutions, Inc.
- 当前专利权人地址: US CA Irvine
- 代理机构: Knobbe, Martens, Olson & Bear, LLP
- 主分类号: H04B1/40
- IPC分类号: H04B1/40 ; H03H9/02 ; H03H9/145 ; H03H9/64 ; H03H9/25 ; H03H9/72 ; H03F3/24
摘要:
An acoustic wave device that includes a spinel layer, a piezoelectric layer, a temperature compensating layer between the spinel layer and the piezoelectric layer and an interdigital transducer electrode on the piezoelectric layer is disclosed. The piezoelectric layer is disposed between the interdigital transducer electrode and the spinel layer. The acoustic wave device is configured to generate an acoustic wave having a wavelength of λ. The piezoelectric layer can have a thickness that is less than λ. In some embodiments, the spinel layer can be a polycrystalline spinel layer.
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